Micro SIM Card Connector 6P,PUSH PULL,H2.4mm

Material:
Base:Hi-Temp Thermoplastic,UL94V-0.Black.
Data Contact:Copper Alloy,Gold Plated.
Shell:Stainless Steel,Gold Plated.
Electrical:

Contact Resistance:50mΩ typical,100Ω Max.
Insulation Resistance:>1000MΩ/500V DC.
3.Solderability
Vapor phase:215ºC.30sec.Max.
IR feflow:250ºC.5sec.Max.
Manual soldering:370ºC.3sec.Max.
Operating Temperature: -45ºC~+105ºC

KLS1-SIM-044-6P.pdf